Advanced packaging and testing, Chiplet? Is it a gimmick, or is it real? Explain the logic of hype

time:2022-09-29 08:30:39 source:clevelanddrifters.com author:Individual stock analysis
Advanced packaging and testing, Chiplet? Is it a gimmick, or is it real? Explain the logic of hype

The routine behind the concept hype, it’s hard to try. Since August 2022, the most hyped concept in the market is called Chiplet technology (don’t worry about what this is, it will be explained in detail later, just treat it as a concept name). What is even more interesting is that we have seen that the relevant leading stocks have all been clarified, and they are still speculation, which is similar to the previous concept speculation. For example, Dagang-Share said, "The company, its subsidiaries and its subsidiary companies are not involved in Chiplet-related business. Suzhou Keyang, a subsidiary of the company, currently mainly uses TSV technology to provide wafer-level packaging and processing services for integrated circuit design companies." All the way to clarify all the way Hype, which is also a typical hot money speculation. Coincidentally, Suzhou-Gutechnetium also publicly stated: "There are some technical reserves, and it will take some time for cutting-edge technologies to be implemented. Chiplets are currently in a laboratory state, and I don't know why the hype is so great." This kind of concept hype can be found in many sectors. , including the previous hype in the automobile and new energy vehicle sectors, Zhongtong-Bus, Haiqi-Group, Zhejiang-Shibao, etc., are all stocks with poor performance and huge losses. There is no substantial factor, but they are the top gainers, even more than once Suspended for monitoring due to excessive gains. In history, the most typical example is Dongfang-Communication, which is the leader of 5G without 5G services, so we need to understand which are pure concepts, apply the speculative and foolish mode, and do not superimpose substantial factors. The truth of Chiplet technology: The so-called Chiplet technology is a kind of technology that improves the integration of chips under the advanced manufacturing process, so as to improve the computing power without changing the manufacturing process and ensure the yield of chip manufacturing. means. To put it more bluntly, it is to assemble the bare chips of different chips, and package SoCs with different IP architectures on a single silicon wafer to achieve the performance and yield of advanced processes (below 7nm) at the cost of mature processes (above 14nm). . For example, in a chip with a 7nm process, some secondary modules can be made into chiplets with a lower process such as 22nm, and then "assembled" to the 7nm chip. The principle is the same as building blocks. Reduce the dependence on the 7nm process. Chiplet mode is also one of the development directions of semiconductor technology under Moore's Law. When the chip manufacturing process reaches below 3nm, it begins to enter the microscopic quantum state, Moore's Law quickly fails (macroscopically measurable, microscopically unmeasurable), and the existing silicon-based technology is basically over. Therefore, cutting a large chip into a small chip (Chiplet) has become an option for the industry to improve the chip yield. At lower ratios, the smaller the die area, the more die are not "hit" by defects. In fact, as early as 2015, AMD reduced the manufacturing cost by 40% through this "small chip" design idea. What the market is expecting these days, though, is a higher-level Chiplet. For example, in March 2022, chip manufacturers such as Intel, AMD, ARM, Qualcomm, TSMC, Samsung, ASE, and technology giants such as Google Cloud, Meta, and Microsoft also jointly established the Chiplet Standard Alliance and officially launched the high-speed interconnection standard for general Chiplets. UCIE", which aims to define an open, interoperable standard for combining multiple Chiplets into a single package in the form of advanced packaging. Ideally, the UCIE standard would allow chipmakers to mix and match chips using different manufacturing process technologies, and be manufactured by different companies into products built into a single package. This means that memory chips made by Micron, CPU chips made by AMD and wireless modems made by Qualcomm will be able to be assembled together, which will greatly improve performance while saving a lot of power. However, it will take at least a few years to realize this, and there is no relevant attempt in the domestic aspect, and there is no industrial chain, let alone mixing. Several core technologies involved in Chiplet: such as chip design, EDA/IP, packaging technology, etc. If you do it yourself, you can't do it yourself. The reason why the Chiplet Alliance was created. ——From this point of view, the scope of my country’s short-term participation is very small. More importantly, Chiplet technology is an improvement, but it is not a substitute for advanced processes (for example, the 3nm mass production factors of Samsung and TSMC are still the most advanced, and it is difficult to match other aspects). "Curve overtaking" is a gimmick in itself. So, are there opportunities for advanced packaging and testing? This aspect is also the key to market hype. Next, this is a detailed explanation of the substantive factors in this field.

(Responsible editor:Trend)